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SPECIAL UNBUFFERED DIMMS
RUGGED XR-DIMM
Data Rate?/?CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
DDR3-XR-DIMM TM
1600 / CL11
2?GB - 8?GB
x72
38 mm x 67.5 mm
1.50?V
240
SGVxxx72xxxxxxx-ssRT
BGA
MINI-UDIMM / MICRODIMM / 100PIN-DIMM
Data Rate?/?CL
Density
Org
Height
Voltage
Pins
Partnumber
Package
DDR3-MiniUDIMM
DDR2-MicroDIMM
DDR1-100PIN DIMM
1333 / CL9
667 / CL5
333 / CL2.5
1?GB - 8?GB
1?GB
128?MB - 512?MB
x72
x64
x72
1.18“ / 0.74”
1.18“ (29.97?mm)
1.00“ (25.40?mm)
1.50?V
1.80?V
2.50?V
244
214
100
SGLxxx72xxxxxxx-ssRT
SEMxxx64xxxxxxx-ssR
SDUxxx32xxxxxxx-ssR
BGA
BGA
TSOP
DDR3 XR-DIMM
DDR3 MINIDIMM
DDR3L, THE NEW STANDARD
default implemented;
on request;
not available;
DDR3 so far has been the interface technology with the
widest range of speed grades. Due to the architectural
features like fly-by-bus, data bus and IO calibration
DDR3 of today has more than twice the speed of the
initial components, and extensions are still in the pipeline.
Due to the technology roadmaps it was possible to signi-
ficantly lower the power consumption. With the latest
DRAM technology it was also possible to reduce the supply
voltage. While the standard DDR3 voltage is at 1.50?V, the
new DDR3L components are operated at 1.35?V, reducing
the memory power consumption by ~15?% under realistic
conditions.
DDR3L has been standardized at JEDEC and is supported
by the latest memory controllers. All new Swissbit DDR3L
modules are fully backwards compatible to DDR3. They
can be operated both with 1.35?V and 1.50?V and be used
both in the newest systems and less recent platforms,
which helps to reduce inventory cost.
25
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